|  |
| Titel:
|
A Feasibility Study of Lead Free Solders for Level 1 Packaging Applications |
| Type:
|
Journal articleJournal article |
| Person(er):
|
Technical University of Denmark
Technical University of Denmark
Email:
Technical University of Denmark
Email:
|
| Uddrag:
|
An attempt has been made to determine the lead free ternary combinations that satisfied the solidification requirement for a solder used in level 1 packaging applications, using the CALPHAD approach. The segregation profiles of the promising candidates were analyzed after scrutinizing the equilibrium calculations by Scheil solidification simulations and optimization. A feasibility study has been carried out for the replacement of high-lead-containing solders with the focus on surface tension, natural radius of curvature, oxidation resistance, intermetallic compound formation, and environmental oriented issues. |
| Publiceret:
|
in journal: Journal of Microelectronics and Electronic Packaging (ISSN: 1551-4897), vol: 6, issue: 1, pages: 75-82, 2009 |
|
|