Helene Conseil

Helene Conseil

Ph.d.-studerende

DTU MEKANIK
Institut for Mekanisk Teknologi

Sektion for Materiale- og Overfladeteknologi

Danmarks Tekniske Universitet

Produktionstorvet

Bygning 425, rum 117

2800 Kgs. Lyngby

Tlf.
Fax 45 25 19 61
E-mail helco@mek.dtu.dk
Hjemmeside

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Publikationer
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2017
 

Printed Circuit Board Surface Finish and Effects of Chloride Contamination, Electric Field, and Humidity on Corrosion Reliability

Conseil, Helene ; Jellesen, Morten Stendahl ; Ambat, Rajan
in journal: Journal of Electronic Materials (ISSN: 0361-5235) (DOI: http://dx.doi.org/10.1007/s11664-016-4974-7), vol: 46, issue: 2, pages: 817–825, 2017

Type: Journal article (Peer reviewed)

Status: Published     |    År: 2017     |    DOI: http://dx.doi.org/10.1007/s11664-016-4974-7

 

Investigation of moisture uptake into printed circuit board laminate and solder mask materials

Conseil, Helene ; Gudla, Visweswara Chakravarthy ; Borgaonkar, Shruti ; Jellesen, Morten Stendahl ; Ambat, Rajan
in journal: Journal of Materials Science: Materials in Electronics (ISSN: 0957-4522) (DOI: http://dx.doi.org/10.1007/s10854-016-6292-5), vol: 28, issue: 8, pages: 6138-6151, 2017

Type: Journal article (Peer reviewed)

Status: Published     |    År: 2017     |    DOI: http://dx.doi.org/10.1007/s10854-016-6292-5

 

Humidity Buildup in Electronic Enclosures Exposed to Constant Conditions

Conseil, Helene ; Staliulionis, Zygimantas ; Jellesen, Morten Stendahl ; Jabbaribehnam, Mirmasoud ; Hattel, Jesper Henri ; Ambat, Rajan
in journal: I E E E Transactions on Components, Packaging and Manufacturing Technology (ISSN: 2156-3950) (DOI: http://dx.doi.org/ 10.1109/TCPMT.2017.2655447), vol: 7, issue: 3, pages: 412 - 423, 2017

Type: Journal article (Peer reviewed)

Status: Published     |    År: 2017     |    DOI: http://dx.doi.org/ 10.1109/TCPMT.2017.2655447

2016
 

Decomposition of no-clean solder flux systems and their effects on the corrosion reliability of electronics

Conseil, Helene ; Verdingovas, Vadimas ; Jellesen, Morten Stendahl ; Ambat, Rajan
in journal: Journal of Materials Science: Materials in Electronics (ISSN: 0957-4522) (DOI: http://dx.doi.org/10.1007/s10854-015-3712-x), pages: 23-32, 2016

Type: Journal article (Peer reviewed)

Status: Published     |    År: 2016     |    DOI: http://dx.doi.org/10.1007/s10854-015-3712-x

  PDF

Experimental study of humidity distribution inside electronic enclosure and effect of internal heating

Conseil, Helene ; Jellesen, Morten Stendahl ; Ambat, Rajan
part of: Proceedings of the European Corrosion Congress : EUROCORR 2015, 2016,
Presented at:
The European Corrosion Congress - EUROCORR 2015, 2015, Graz

Type: Article in proceedings (Peer reviewed)

Status: Published     |    År: 2016

 

Humidity Build-Up in a Typical Electronic Enclosure Exposed to Cycling Conditions and Effect on Corrosion Reliability

Conseil, Helene ; Gudla, Visweswara Chakravarthy ; Jellesen, Morten Stendahl ; Ambat, Rajan
in journal: I E E E Transactions on Components, Packaging and Manufacturing Technology (ISSN: 2156-3950) (DOI: http://dx.doi.org/10.1109/TCPMT.2016.2590779), vol: 6, issue: 9, pages: 1379-1388, 2016

Type: Journal article (Peer reviewed)

Status: Published     |    År: 2016     |    DOI: http://dx.doi.org/10.1109/TCPMT.2016.2590779

 

Semi-empirical prediction of moisture build-up in an electronic enclosure using analysis of variance (ANOVA)

Shojaee Nasirabadi, Parizad ; Conseil, Helene ; Mohanty, Sankhya ; Jabbaribehnam, Mirmasoud ; Ambat, Rajan ; Hattel, Jesper Henri
part of: Proceedings of the 18th Electronics Packaging and Technology Conference (EPTC) , pages: 785-790, 2017, IEEE,
Presented at:
18th Electronics Packaging Technology Conference (EPTC), 2016, Singapore

Type: Article in proceedings (Peer reviewed)

Status: Published     |    År: 2016     |    DOI: http://dx.doi.org/ 10.1109/EPTC.2016.7861588

 

Improving intrinsic corrosion reliability of printed circuit board assembly

Ambat, Rajan ; Conseil, Helene
part of: Proceedings of the 18th Electronics Packaging and Technology Conference (EPTC) , pages: 540-544, 2017, IEEE,
Presented at:
18th Electronics Packaging Technology Conference (EPTC), 2016, Singapore

Type: Article in proceedings (Peer reviewed)

Status: Published     |    År: 2016     |    DOI: http://dx.doi.org/10.1109/EPTC.2016.7861538

2015
 

Experimental study of humidity and temperature profile into electronic enclosure exposed to high humidity and thermal cycles

Conseil, Helene ; Jellesen, Morten Stendahl ; Ambat, Rajan
part of: Proceedings of the IMAPS Nordic Annual Conference 2015 (ISBN: 9781510808133), pages: 111-117, 2016, International Microelectronics and packaging Society,
Presented at:
IMAPS Nordic Annual Conference 2015, 2015, Helsingør

Type: Article in proceedings (Peer reviewed)

Status: Published     |    År: 2015

2014
  PDF

Perspectives on the climatic reliability issues of electronic devices

Ambat, Rajan ; Jellesen, Morten Stendahl ; Verdingovas, Vadimas ; Piotrowska, Kamila ; Conseil, Helene
part of: Proceedings of EuroCorr 2014, 2014,
Presented at:
European Corrosion Congress, 2014, Pisa

Type: Article in proceedings (Peer reviewed)

Status: Published     |    År: 2014