Feng Li

Feng Li

PhD student

DTU MECHANICAL ENGINEERING
Department of Mechanical Engineering

Section of Materials and Surface Engineering

Technical University of Denmark

Produktionstorvet

Building 425, room 117

2800 Kgs. Lyngby

Ph.
Fax +45 45 25 19 61
E-mail feli@mek.dtu.dk
ORCID 0000-0002-6582-2086
Home page

Request a vCard via e-mail.

Publications
Projects
Loading

Publications rss feed

2020
 

Humidity Robustness of Plasma-Coated PCBs

Khangholi, Aliakbar ; Li, Feng ; Piotrowska, Kamila ; Loulidi, Samir ; Ambat, Rajan ; Van Assche, Guy ; Hubin, Annick ; De Graeve, Iris
in: Journal of Electronic Materials, vol: 49, issue: 1, pages: 848-860

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2020     |    DOI: https://doi.org/10.1007/s11664-019-07714-5

2019
 

Thermal decomposition of binary mixtures of organic activators used in no-clean fluxes and impact on PCBA corrosion reliability

Piotrowska, Kamila ; Li, Feng ; Ambat, Rajan
in: Soldering & Surface Mount Technology

Type: Journal article (Peer reviewed)

Status: Accepted/In press     |    Year: 2019     |    DOI: https://doi.org/10.1108/ssmt-05-2019-0020

2018
 

Corrosion Reliability of Lead-Free Solder Systems Used in Electronics

Li, Feng ; Verdingovas, Vadimas ; Dirscherl, Kai ; Medgyes, Balint ; Ambat, Rajan
part of: Proceedings 2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac 2018) , pages: 67-71, 2019, IEEE
Presented at:
2018 IMAPS Nordic Conference on Microelectronics Packaging (NORDPAC 2018)

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2018     |    DOI: https://doi.org/10.23919/NORDPAC.2018.8423855

2017
 

Corrosion reliability of lead-free solder systems used in electronics

Li, Feng ; Verdingovas, Vadimas ; Medgyes, Balint ; Ambat, Rajan
part of: Proceedings of the 40th International Spring Seminar on Electronics Technology (ISSE), 2017 , 2017, IEEE
Presented at:
40th International Spring Seminar on Electronics Technology

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2017     |    DOI: https://doi.org/10.1109/ISSE.2017.8000929

 

Corrosion Reliability of Lead-free Solder Systems Used in Electronics

Li, Feng ; Verdingovas, Vadimas ; Medgyes, Balint ; Ambat, Rajan
part of: Proceedings of the European Corrosion Congress (EUROCORR 2017), 2017
Presented at:
European Corrosion Congress (EUROCORR 2017)

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2017


https://www.mek.dtu.dk/english/research/publications/person?id=104535&tab=2&qt=dtupublicationquery
29 FEBRUARY 2020